HotSense

ACM International Workshop on Thermal Sensing and Computing

Co-located with ACM MobiCom 2025 | November 8, 2025 | Hong Kong, China

Visible Light View Thermal Infrared View
Visible Light Thermal Infrared

Welcome to HotSense: The ACM International Workshop on Thermal Sensing and Computing

Thermal is the new visual—with privacy. As smart systems move ever deeper into our homes, hospitals, factories, and cities, the demand for privacy-preserving, spatially rich, and context-aware sensing has never been greater. HotSense is the first dedicated workshop to explore the full stack of thermal sensing and computing, bringing together researchers from mobile computing, embedded systems, HCI, computer vision, robotics, and AI to chart this fast-emerging frontier.

From gesture recognition to depth estimation, from indoor localization to human-machine interaction, from health monitoring to emergency response, thermal sensing offers a powerful yet underexplored modality for ubiquitous computing. With increasingly accessible and compact sensors (e.g., FLIR, Melexis, Meridian), researchers are deploying thermal systems where traditional vision and RF sensing fall short, whether in low-light, occluded, or privacy-sensitive environments.

HotSense @ MobiCom 2025 offers a timely, interdisciplinary venue to shape the future of thermal computing:

  • Share cutting-edge results and platforms
  • Spark dialogue between mobile systems and vision communities
  • Build a global research network around thermal sensing

At its core, HotSense aims to catalyze a vibrant research community around thermal perception and computation—one that spans algorithms, hardware, systems, and real-world applications.

🔥 Thermal sensing is hot! Join us at HotSense @ MobiCom 2025, and help redefine how intelligent systems perceive and interact with the physical world—with thermal.

Important Dates

Aug 10, 2025
Paper Submission Deadline (extended)
September 15, 2025
Notification of Acceptance
September 30, 2025
Camera-Ready Deadline
November 8, 2025
Workshop Date

Call for Papers

HotSense is the first workshop dedicated to the full spectrum of thermal sensing and computing across mobile, embedded, and intelligent systems. We welcome original research papers, position papers, and early-stage exploratory work that examine the design, implementation, analysis, and application of thermal sensing systems.

While particular attention will be given to low-cost, low-resolution thermal arrays, the workshop encourages broader contributions across the hardware–algorithm–application stack, including novel sensing modalities, computing frameworks, and cross-disciplinary applications.

Topics of interest include (but are not limited to):

  • Gesture, activity, and pose recognition using thermal/infrared signals
  • Thermal localization and tracking
  • Thermal depth estimation and ranging
  • Thermal imaging and space reconstruction
  • Robotic perception and navigation augmented by thermal vision
  • Material sensing and object classification using thermal signatures
  • Privacy-preserving sensing for homes, healthcare, and interactions
  • Energy-efficient algorithms and embedded platforms for thermal sensing
  • Machine learning and multimodal fusion for thermal perception
  • Novel sensors, optics, and metasurface designs
  • Thermal sensing for building occupancy and energy efficiency
  • Applications in health, AR/VR, cities, and emergency response

Submission Instructions

  • Originality: Submissions must be original, unpublished work, and not under review elsewhere.
  • Format: Papers should be submitted in PDF format, be no longer than 5 pages, excluding references, and follow the ACM SIGMOBILE double-column format.
  • Review Process: The review process will be double-blind. Authors must anonymize their submissions by removing names, affiliations, and any other identifying information for peer review.
  • Publication: Accepted papers will be presented at the workshop and published in the ACM Digital Library as part of the MobiCom 2025 Workshop Proceedings.

If you have any questions, please contact Chengxiao via email.

Program (Tentative)

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Welcome and Workshop Introduction

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Keynote I: Heat-assisted Detection and Ranging

Prof. Fanglin Bao
Westlake University

Abs: The emerging Industry 4.0 of smart technologies calls for a future with scalable human-robot social interactions. It is expected that one in ten vehicles will be automated by 2030, and millions of robot helpers will be serving people. Each of these intelligent agents will ‘observe and see’ its surrounding scene through advanced sensors, to form a computer vision and make decisions without human intervention. Traditional cameras cannot function in the dark. State-of-the-art sensors (such as LiDAR, radar, and sonar) to enhance the camera vision face difficulties when the number of intelligent agents scales up. Thermal imaging could be a new frontier in machine perception but suffers from the ‘ghosting effect’. Based on our recent research, this talk will elaborate on the mechanism of the ghosting effect and how HADAR, as featured in Nature (2023), can overcome it, enabling high-resolution night vision for future machine perception.

Bio: Dr. Fanglin Bao is an assistant professor in the School of Science, Westlake University, focusing on information physics and optics. Dr. Bao received his B.S. in Physics (2011) and Ph.D. in Optics (2016) from Zhejiang University. He studied quantum vacuum fluctuations, worked out the renormalization of the Casimir force in inhomogeneous systems, and discovered the inhomogeneity-induced Casimir transport phenomenon — a nanoscale ‘maglev train’ based on quantum levitation. Before joining Westlake University in 2024, he was a postdoctoral scholar and later a research scientist at Purdue University, where he worked on quantum optical sensing. He developed heat-assisted detection and ranging (HADAR), quantum-accelerated imaging, and adaptive photon-thresholding detection. For the series of work on HADAR, Dr. Bao was recognized with awards, including the Intelligent Computing Innovator in 2023 by MIT Technology Review.

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Keynote II: Title TBD

Stanislav Markov
Meridian Innovation

Bio: Dr. Stanislav Markov is a Scientist and Director at Meridian Innovation, where he leads multidisciplinary efforts in advancing thermal imaging technologies—ranging from silicon MEMS hardware to software-driven thermal data analytics for both consumer and commercial applications. His expertise extends across nanoelectronic semiconductor devices and materials, leveraging advanced modeling techniques such as molecular dynamics, atomistic DFTB + NEGF quantum transport, and statistical reliability analysis in CMOS technologies. In addition to his academic contributions, he has deep experience in scientific software development, TCAD/EDA tools, RTL design and verification for digital ASICs, SoCs, and FPGAs, as well as low-level hardware programming and process control system design.

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Technical Paper Sessions

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Hands-on Tutorial Session

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Panel Discussion and Open Q&A

Organizing Committee

General Chairs

Chenshu Wu

Chenshu Wu

The University of Hong Kong, HK SAR, China

Niki Trigoni

Niki Trigoni

University of Oxford, UK

Vishwanath Saragadam

Vishwanath Saragadam

University of California, Riverside, USA

Technical Program Committee

Publicity Chair

Workshop Web Chair

Sponsors